EDGE Tech Corporation - EDGE NextGen
Solid state drive - 1 TB - internal - M.2 2280 (double-sided) - PCI Express 3.0 x4 (NVMe)
EDGE Tech Corporation
PE252465
N/A
N/A
N/A
New
Product Description
Additional Details
What's Included
| Main Specifications | |
|---|---|
| Product Description | EDGE NextGen - solid state drive - 1 TB - PCI Express 3.0 x4 (NVMe) |
| Type | Solid state drive - internal - temperature sensor, TRIM support, StaticDataRefresh Technology, Wear Leveling Support, Data Path Protection, 3D NAND Technology, SLC cache, Advanced LDPC ECC Technology, NVM Express (NVMe) 1.3, Silicon Motion SM2262 controller, L1.2 low-power mode |
| Capacity | 1 TB |
| NAND Flash Memory Type | 3D triple-level cell (TLC) |
| Form Factor | M.2 2280 (double-sided) |
| Interface | PCI Express 3.0 x4 (NVMe) |
| Features | Temperature sensor, TRIM support, StaticDataRefresh Technology, Wear Leveling Support, Data Path Protection, 3D NAND Technology, SLC cache, Advanced LDPC ECC Technology, NVM Express (NVMe) 1.3, Silicon Motion SM2262 controller, L1.2 low-power mode, S.M.A.R.T. |
| Dimensions (WxDxH) | 0.9 in x 3.1 in x 0.1 in |
| Weight | 0.25 oz |
| Manufacturer Warranty | 3-year warranty |
| General | |
| Device Type | Solid state drive - internal |
| Capacity | 1 TB |
| NAND Flash Memory Type | 3D triple-level cell (TLC) |
| Form Factor | M.2 2280 (double-sided) |
| Interface | PCI Express 3.0 x4 (NVMe) |
| Features | Temperature sensor, TRIM support, StaticDataRefresh Technology, Wear Leveling Support, Data Path Protection, 3D NAND Technology, SLC cache, Advanced LDPC ECC Technology, NVM Express (NVMe) 1.3, Silicon Motion SM2262 controller, L1.2 low-power mode, S.M.A.R.T. |
| Width | 0.9 in |
| Depth | 3.1 in |
| Height | 0.1 in |
| Weight | 0.25 oz |
| Manufacturer Warranty | |
| Service & Support | Limited warranty - 3 years |
| Miscellaneous | |
| Compliant Standards | FCC, RoHS, WWN |
| TAA Compliant | Yes |
| Power | |
| Power Consumption | 5.7 Watt (active) ¦ 0.3 Watt (idle) |
| Environmental Parameters | |
| Min Operating Temperature | 32 °F |
| Max Operating Temperature | 158 °F |
| Min Storage Temperature | -40 °F |
| Max Storage Temperature | 185 °F |
| Performance | |
| Internal Data Rate | 2710 MBps (read) / 1775 MBps (write) |
| Maximum 4KB Random Write | 280000 IOPS |
| Maximum 4KB Random Read | 283000 IOPS |
| Reliability | |
| MTBF | 1,500,000 hours |
| Expansion & Connectivity | |
| Interfaces | 1 x PCI Express 3.0 x4 - M.2 Card |
| Compatible Bay | M.2 2280 (double-sided) |